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1. product profile 1.1 general description the IP4035CX24 is a 10-channel rc low-pass filter array which is designed to provide filtering of undesired rf signals. in additi on, the IP4035CX24 incorporates diodes to provide protection to downstream compon ents from electrostatic discharge (esd) voltages as high as 30 kv contact according the iec 61000-4-2 standard, far exceeding level 4. the IP4035CX24 is fabricated using mono lithic silicon technolo gy and integrates 10 resistors and 20 diodes in a single wafer-leve l chip-scale package (wlcsp). these features make the IP4035CX24 ideal for use in applications requiring the utmost in miniaturization such as mobile phone handsets , cordless telephones and personal digital devices. 1.2 features and benefits ? pb-free, rohs compliant and free of ha logen and antimony (dark green compliant) ? 10-channel integrated -type rc filter network ? 1 k series resistance; 100 pf (typical) channel capacitance ? integrated esd protection withstanding 30 kv contact discharge, far exceeding iec 61000-4-2 level 4 ? wlcsp with 0.5 mm pitch 1.3 applications reduce electromagnetic interference (emi) and radio frequency interference (rfi) and provide downstream esd protection for: ? cellular and personal communication system (pcs) mobile handsets ? cordless telephones ? other appliances with low frequency signals (e.g. keypads) IP4035CX24 10-channel integrated filter ne twork with esd input protection to iec 61000-4-2 level 4 rev. 01 ? 12 february 2010 product data sheet
IP4035CX24_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 2 of 12 nxp semiconductors IP4035CX24 10-channel integrated filter network with esd input protection 2. pinning information 2.1 pinning 2.2 pin description fig 1. pin configuration IP4035CX24 008aaa19 1 transparent top view, solder balls facing down d b e c a 24 135 bump a1 index area table 1. pinning pin description b1 and d1 filter channel 1 a2 and d2 filter channel 2 b2 and d3 filter channel 3 a5 and d4 filter channel 4 b5 and d5 filter channel 5 c1 and e1 filter channel 6 c2 and e2 filter channel 7 c3 and e3 filter channel 8 c4 and e4 filter channel 9 c5 and e5 filter channel 10 a3, a4, b3, b4 ground a1 no ball
IP4035CX24_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 3 of 12 nxp semiconductors IP4035CX24 10-channel integrated filter network with esd input protection 3. ordering information 4. functional diagram 5. limiting values [1] device is qualified with 1 000 pulses of 15 kv contact discharges each, according to the iec 61000-4-2 model and far exceeds the specified level 4 (8 kv contact discharge). table 2. ordering information type number package name description version IP4035CX24 wlcsp24 wafer level chip-size package; 24 bumps; 2.45 2.41 0.65 mm IP4035CX24 fig 2. schematic diagram IP4035CX24 008aaa19 2 a2, a5, b1, b2, b5, c1, c2, c3, c4, c5 a3, a4, b3, b4 d1, d2, d3, d4, d5, e1, e2, e3, e4, e5 r s(ch) table 3. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v i input voltage ? 0.5 +5.5 v v esd electrostatic discharge voltage all pins to ground contact discharge [1] ? 30 +30 kv air discharge [1] ? 30 +30 kv iec 61000-4-2 level 4; all pins to ground contact discharge ? 8 +8 kv air discharge ? 15 +15 kv i ch channel current (dc) current flow between external and internal pins - 7 ma p ch channel power dissipation continuous power - 42 mw p tot total power dissipation continuous power - 420 mw t stg storage temperature ? 55 +150 c t reflow(peak) peak reflow temperature 10 s maximum - 260 c t amb ambient temperature ? 45 +85 c
IP4035CX24_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 4 of 12 nxp semiconductors IP4035CX24 10-channel integrated filter network with esd input protection 6. characteristics table 4. channel characteristics t amb = 25 c; unless otherwise specified. symbol parameter conditions min typ max unit r s(ch) channel series resistance 900 1 000 1 100 c ch channel capacitance v bias(dc) = 0 v; f = 1 mhz 40 50 60 pf v br breakdown voltage i test = 1 ma 6 - 15 v i lr reverse leakage current per channel; v i = 3.0 v - - 20 na table 5. frequency characteristics t amb = 25 c; unless otherwise specified. symbol parameter conditions min typ max unit il insertion loss 800 mhz < f < 3 ghz; r gen = 50 ; r l = 50 - 25 - db ct crosstalk attenuation 800 mhz < f < 3 ghz; r gen = 50 ; r l = 50 - ? 25 - db
IP4035CX24_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 5 of 12 nxp semiconductors IP4035CX24 10-channel integrated filter network with esd input protection 7. application information 7.1 insertion loss the insertion loss measurement configuration of a typical 50 network analyzer (nwa) system for evaluation of the IP4035CX24 is shown in figure 3 . the insertion loss of all channels for frequencies up to 6 ghz is displayed in figure 4 . the insertion loss is measured with a test pc b utilizing laser drilled micro-via holes that connect the pcb ground plane to the IP4035CX24 ground pins. fig 3. frequency response measurement configuration (1) channel 1 (pins b1 and d1). (2) channel 10 (pins c5 and e5). (3) channel 6 (pins c1 and e1). (4) channel 5 (pins b5 and d5). (5) channel 9 (pins c4 and e4). (6) channel 8 (pins c3 and e3). (7) channel 3 (pins b2 and d3). (8) channel 2 (pins a2 and d2). (9) channel 4 (pins a5 and d4). (10) channel 7 (pins c2 and e2). fig 4. measured insertion loss magnitudes out 001aai75 5 50 50 v gen dut in test board 001aak011 f (mhz) 1 10 4 10 3 10 10 2 ? 20 ? 30 ? 40 ? 50 ? 60 ? 10 0 s 21 (db) ? 70 (1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
IP4035CX24_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 6 of 12 nxp semiconductors IP4035CX24 10-channel integrated filter network with esd input protection 7.2 crosstalk the crosstalk measurement configuration of a typical 50 nwa system for evaluation of the IP4035CX24 is shown in figure 5 . the measured crosstalk within the IP4035CX24 in a 50 nwa system from one channel to another is shown in figure 6 for two different pairs of channels representing both the worst and the best case conditions in terms of physical distance. in both cases the signal input pin is c1. while pin e2 is very close to the input, pin e5 is relatively far away. in all cases, unused connections are terminated with 50 to ground. fig 5. crosstalk measurement configuration (1) channels 6 and 7 (pins c1 and e2). (2) channels 6 and 10 (pins c1 and e5). fig 6. measured crosstalk between adjacent channels out_2 001aai75 6 50 50 v gen dut in_1 out_1 in_2 test board 50 50 001aak010 f (mhz) 1 10 4 10 3 10 10 2 ? 20 ? 30 ? 40 ? 50 ? 60 ? 10 0 ct (db) ? 70 (1) (2)
IP4035CX24_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 7 of 12 nxp semiconductors IP4035CX24 10-channel integrated filter network with esd input protection 8. package outline fig 7. package outline IP4035CX24 (wlcsp24) wlcsp24_5x5-a1_po european projection w lcsp24: wafer level chip-size package; 24 bumps (5 x 5 - a1) bump a1 index area d e x detail x a a 2 a 1 e 1 e 1 e e b e d c b a 12345 table 6. dimensions for figure 7 symbol min typ max unit a 0.60 0.65 0.70 mm a 1 0.22 0.24 0.26 mm a 2 0.38 0.41 0.44 mm b 0.27 0.32 0.37 mm d 2.40 2.45 2.50 mm e 2.36 2.41 2.46 mm e - 0.5 - mm e 1 - 2.0 - mm
IP4035CX24_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 8 of 12 nxp semiconductors IP4035CX24 10-channel integrated filter network with esd input protection 9. design and asse mbly recommendations 9.1 pcb design guidelines for optimum performance it is recommended to use a non-solder mask pcb design (nsmd), also known as a coppe r-defined design, in corporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. this results in the lowest possible ground inductance and provides the best high frequency and esd performance. for this case, refer to table 7 for the recommended pcb design parameters. 9.2 pcb assembly guidelines for pb-free soldering table 7. recommended pcb design parameters parameter value or specification pcb pad diameter 200 m micro-via diameter 100 m (0.004 inch) solder mask aperture diameter 370 m copper thickness 20 m to 40 m copper finish auni pcb material fr4 table 8. assembly recommendations parameter value or specification solder screen aperture diameter 330 m solder screen thickness 100 m (0.004 inch) solder paste: pb-free snag (3 % to 4 %) cu (0.5 % to 0.9 %) solder / flux ratio 50 / 50 solder reflow profile see figure 8 the device is capable of withstanding at least three reflows of this profile. fig 8. pb-free solder reflow profile 001aai94 3 t reflow(peak) 250 230 217 t ( c) cooling rate pre-heat t 1 t 5 t 4 t 3 t 2 t (s)
IP4035CX24_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 9 of 12 nxp semiconductors IP4035CX24 10-channel integrated filter network with esd input protection 10. abbreviations 11. revision history table 9. characteristics symbol parameter conditions min typ max unit t reflow(peak) peak reflow temperature 230 - 260 c t 1 time 1 soak time 60 - 180 s t 2 time 2 time during t 250 c - - 30 s t 3 time 3 time during t 230 c 10 - 50 s t 4 time 4 time during t > 217 c 30 - 150 s t 5 time 5 - - 540 s dt/dt rate of change of temperature cooling rate - - ? 6 c/s pre-heat 2.5 - 4.0 c/s table 10. abbreviations acronym description dut device under test emi electromagnetic interference esd electrostatic discharge fr4 flame retard 4 nsmd non-solder mask pcb design pcb printed-circuit board pcs personal communication system rfi radio frequency interference rohs restriction of hazardous substances wlcsp wafer-level chip-scale package table 11. revision history document id release date data sheet status change notice supersedes IP4035CX24_1 20100212 product data sheet - -
IP4035CX24_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 10 of 12 nxp semiconductors IP4035CX24 10-channel integrated filter network with esd input protection 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 12.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 12.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer?s third party customer(s) (hereinafter both referred to as ?application?). it is customer?s sole responsibility to check whether the nxp semiconductors product is suitable and fit for the application planned. customer has to do all necessary testing for the application in order to avoid a default of the application and the product. nxp semiconducto rs does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. non-automotive qualified products ? unless the data sheet of an nxp semiconductors product expressly states that the product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive sp ecifications and standards, customer (a) shall use the product without nx p semiconductors? warranty of the document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objec tive specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
IP4035CX24_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 11 of 12 nxp semiconductors IP4035CX24 10-channel integrated filter network with esd input protection product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully in demnifies nxp semi conductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive appl ications beyond nxp semiconductors? standard warranty and nxp semicond uctors? product specifications. 12.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 13. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors IP4035CX24 10-channel integrated filter network with esd input protection ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 12 february 2010 document identifier: IP4035CX24_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 14. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 application information. . . . . . . . . . . . . . . . . . . 5 7.1 insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.2 crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 design and assembly recommendations . . . . 8 9.1 pcb design guidelines . . . . . . . . . . . . . . . . . . . 8 9.2 pcb assembly guidelines for pb-free soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 legal information. . . . . . . . . . . . . . . . . . . . . . . 10 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 12.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13 contact information. . . . . . . . . . . . . . . . . . . . . 11 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

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